What is the recommended storage temperature for Balver Zinn JEAN-151?

For optimum performance and to achieve its minimum 12 month shelf life, JEAN-151 solder paste should be stored refrigerated between 4°C and 10°C. Ensure the paste reaches room temperature (approx. 6–8 hours) before opening the container to prevent moisture condensation.

How long is the stencil life of JEAN-151 No-Clean Solder Paste?

JEAN-151 offers an exceptional 24-hour stencil life. It maintains consistent viscosity and rolling behaviour even in high-humidity environments, significantly reducing waste during long SMT production runs.

Are JEAN-151 flux residues probe-testable without cleaning?

Yes, JEAN-151 is a genuine No-Clean formulation. The resulting flux residues are clear, non-corrosive, and specifically designed to be probe-testable for seamless quality control without the need for additional cleaning stages.

What is the shelf life of JEAN-151 when supplied by DKL Metals?

When stored correctly under refrigeration (4-10°C), JEAN-151 has a guaranteed shelf life of 12 months from the date of manufacture. DKL Metals ensures all batches are labelled with specific expiry dates for full traceability.

What is the recommended storage temperature for Cobar OT2 solder paste?

After receiving your solder paste from DKL Metals, it should immediately be stored between 8 °C and ambient room temperature. Unlike traditional pastes, DO NOT store Cobar OT2 in a standard refrigerator or below 8 °C, as low temperatures can compromise the stability of this specific chemistry. Always store cartridges horizontally and rotate them monthly to eliminate flux segregation.

Do I need to clean Cobar OT2 no-clean flux residues after reflow?

No. Cobar OT2 is a true no-clean formula. The clear residues remaining on the printed board assembly (PBA) after soldering are completely chemically inert, non-conductive, and safe to leave on the board. However, if cosmetic cleaning or subsequent conformal coating is required, residues can be removed using Cobar MCA-1424 aqueous cleaner. Misprints and stencil tools can be cleaned with MCI-2330.

How do I prevent graping and head-in-pillow defects with OT2 flux?

The Cobar OT2 platform features an advanced activator system specifically engineered to eliminate graping and head-in-pillow (HiP) defects during reflow. To maximize its effectiveness on poor-wetting board finishes, utilise a linear reflow profile. Ensure your flux activation time (FAT) between 150 °C and 200 °C remains between 20 to 150 seconds, with a peak reflow temperature between 240 °C and 260 °C.

What are the optimal printer squeegee settings for high-speed SMT lines?

Printing speeds between 25–100 mm/s, apply a squeegee pressure of 0.20 kg/cm. For high-speed SMT printing between 100–200 mm/s, increase pressure slightly to 0.25 kg/cm. It is recommended to decrease pressure by 5% for every 1 °C rise in ambient temperature above 23 °C. If your printing line halts for more than 4 hours, a total stencil clean is highly recommended before restarting.

What is the typical stencil life and tack time for fine pitch SMT solder paste?

The typical stencil life is over 3 days (72 hours), maintaining a reliable 72-hour tack life window. This extended open time provides excellent print definition for fine pitch and ultra-fine pitch components while significantly reducing assembly line downtime.

What does an ROL0 flux classification mean for electronic circuit reliability?

An ROL0 classification means the flux contains zero detectable halides and poses the lowest possible risk for corrosion or electrical failure. Under J-STD-004B specifications, this ensures minimal, transparent, and completely probe-testable residues that are 100% safe to leave on assemblies without washing.

How is a solder paste verified as completely halogen and halide-free?

Solder paste is verified as halogen-free through rigorous ion chromatography testing to ensure no halide materials were added. This independent material verification allows modern electronic assemblies to pass strict international environmental compliance checks effortlessly.

What are the recommended storage temperatures and shelf life for SAC305 solder paste?

The recommended storage temperature is refrigerated below 10°C, providing a 12-month shelf life for tubs and cartridges. For unopened syringe units, the shelf life is 6 months. Always allow the paste to naturally warm to room temperature and stir thoroughly before beginning a production print run.

Electronic Solder Pastes | SN100C & Lead-Free SMT Alloys | 2026

JEAN-151 No-Clean Solder Paste

admin — Mon, 09 Mar 2026 12:07:46 +0000

/* 1. MAIN WRAPPERS */ .product-custom-layout { padding: 10px 0; background: #fff; contain: layout; font-family: Arial, sans-serif; line-height: 1.6; color: #333; } .product-custom-layout__container { max-width: 800px; width: 100%; margin: 0 auto; box-sizing: border-box;} /* 2. THE BIG BLUE H1 & HEADINGS */ .product-custom-layout + h1, .product-page h1, .entry-title, .page-title { background: linear-gradient(135deg, #1e3a8a, #3b82f6) !important; color: white !important; text-align: center !important; padding: 10px !important; border-radius: 10px !important; font-size: 2.5em !important; margin: 0 0 20px 0 !important; text-shadow: 2px 2px 4px rgba(0,0,0,0.3) !important; display: block !important; } .product-custom-layout h2 { color: #1e3a8a; border-bottom: 3px solid #3b82f6; padding-bottom: 10px; font-size: 2.2em; margin: 30px 0 15px 0; } .product-custom-layout h3 { color: #1e40af; font-size: 1.4em; margin: 30px 0 15px 0; display: flex; align-items: center; gap: 10px; } /* 3. TABLES */ .flux-specs-table { width: 100%; border-collapse: collapse; margin: 25px 0; box-shadow: 0 10px 30px rgba(0,0,0,0.1); border-radius: 10px; overflow: hidden; } .flux-specs-table th { background: linear-gradient(135deg, #1e3a8a, #3b82f6); color: white; padding: 15px; text-align: left; } .flux-specs-table td { padding: 15px; border-bottom: 1px solid #eee; } .flux-specs-table tr:nth-child(even) { background: #f8fafc; } /* 4. UNIFIED DROPDOWNS (Alloys & FAQ) */ .alloy-dropdown-section details, .solder-faq-section details { background: #f8fafc; border: 1px solid #e2e8f0; border-radius: 8px; margin-bottom: 10px; transition: all 0.3s ease; } details[open] { background: #fff !important; border-color: #3b82f6 !important; box-shadow: 0 4px 12px rgba(59, 130, 246, 0.1); } summary { list-style: none; display: flex; align-items: center; padding: 15px 20px; cursor: pointer; font-weight: bold; color: #1e3a8a; } summary span { margin-left: auto; transition: transform 0.3s ease; font-size: 1.2em; } details[open] summary span { transform: rotate(45deg); color: #3b82f6; } .dropdown-content { padding: 0 20px 20px 20px; color: #4b5563; } /* 5. THE "μm" BLUEPRINT CARDS */ .flux-cards { display: flex; gap: 15px; margin-top: 25px; flex-wrap: wrap;} .flux-card { flex: 1 1 250px; background: #fff; border: 1px solid #e2e8f0; border-radius: 16px; padding: 30px 25px; position: relative; overflow: hidden; transition: all 0.4s cubic-bezier(0.175, 0.885, 0.32, 1.275); } .flux-card::before { content: "μm"; position: absolute; bottom: -10px; right: -5px; font-size: 5em; font-weight: 900; color: #f8fafc; z-index: 0; pointer-events: none; } .flux-card::after { content: ""; position: absolute; left: 0; top: 0; height: 100%; width: 5px; background: #3b82f6; opacity: 0.5; } .flux-card:hover { transform: translateY(-8px); box-shadow: 0 20px 25px -5px rgba(59, 130, 246, 0.1); border-color: #3b82f6; } .flux-card h4 { color: #1e3a8a; font-size: 1.4em; margin: 0 0 10px 0; position: relative; z-index: 1; font-weight: 800; } .flux-card p { font-size: 0.95em; margin: 0; position: relative; z-index: 1; } .microns { display: inline-block; background: #eff6ff; color: #1e40af; padding: 2px 8px; border-radius: 4px; font-weight: bold; margin-bottom: 10px; position: relative; z-index: 1; } @media (max-width: 1024px) { .product-custom-layout { margin-left: 0 !important; margin-right: 0 !important; width: auto !important; } .product-custom-layout__container { padding: 0 10px !important; max-width: 100% !important; } } @media (max-width: 768px) { .product-custom-layout h2 { font-size: 1.8em !important; } .flux-specs-table td, .flux-specs-table th { padding: 10px 8px !important; font-size: 0.9em; } summary { padding: 12px 15px !important; font-size: 0.95em; } }

A Solder Paste Designed for Reflow and Vapor Phase Soldering

As an official UK distributor, DKL Metals provides Balver Zinn JEAN-151 No-Clean Solder Paste. This versatile flux platform meets the high demands of modern SMT assembly. The halide-free, ROL0 flux actively prevents bridging and mid-chip solder balling. It remains highly effective even for challenging fine-pitch applications. The platform supports many alloys, from high-reliability SN100CV® to standard SAC305. It performs just as well in vapour phase soldering as it does in reflow. An exceptional 24-hour stencil life keeps your line running longer with less waste. Finally, clear, probe-testable residues ensure your quality control remains seamless.

Technical Specifications

Source: Balver Zinn Official Technical Data
Standard / Property	Classification / Value
DIN-EN-29454-1: 2016	1122
IPC-J-STD-004-B: 2004	ROL0
IPC-J-STD-005 (Powder)	T3 / T4 / T5
Particle Size [µm]	25-45 / 20-38 / 15-25

Available Alloy Configurations

DKL EF-28 Alcohol-Resin Paste Flux

admin — Tue, 20 Jan 2026 13:01:14 +0000

DKL EF-28 Alcohol-Resin Paste Flux delivers high performance for professional electronic soldering. This preparation contains a precise blend of 60-80% Gum Rosin (Colophony) and 15-20% Propan-2-ol. Consequently, the flux provides superior wetting for high-reliability assemblies. It cleans tinned copper surfaces effectively. Furthermore, the formula leaves non-corrosive residues that remain safe on your finished assembly.

EF-28 Performance Characteristics & Technical Benefits

The DKL EF-28 is formulated to meet the rigorous characterisation requirements of the IPC J-STD-004B standard for high-quality interconnections.

DKL engineered EF-28 for the rigorous demands of modern manufacturing. It ensures excellent solderability with legacy leaded alloys and modern lead-free options. This ROM1 classified rosin flux offers several industrial advantages:

Superior Wetting: The flux initiates rapid action on precision copper components.
High-Reliability Formula: Resin chemistry produces stable, non-corrosive residues. These residues protect long-term board performance.
Versatile Compatibility: It supports leaded alloys like Sn60/Pb40. Additionally, it works perfectly with lead-free alternatives like SN100C®.
No-Clean Efficiency: Most users treat this as a no-clean paste flux. However, you can remove residues easily with isopropyl alcohol for coating preparation.

Application Methods for EF-28 Alcohol-Resin Paste Flux

Apply EF-28 flux paste using a brush or dipping method. Solder the components immediately with a standard iron or induction heat. Afterwards, the flux cools into a hard, protective barrier. Therefore, you do not need to perform post-process cleaning in standard environments.

EF-28 Paste Flux Format Availability:

Standard Stock: We supply 500g and 1kg industrial containers.
Bulk Supply: Custom large-volume sizes are available upon request.
Physical State: The stable paste features a faint, non-pungent odour.

Health, Safety & Compliance

Always follow standard workshop safety protocols when handling this flammable flux. Wear appropriate eye and skin protection. Moreover, you must ensure the workspace has adequate fume extraction. Soldering fumes can irritate the respiratory system. For this reason, avoid prolonged exposure.

We provide the full Safety Data Sheet (SDS) for DKL EF-28 Alcohol-Resin Paste Flux upon request. DKL Metals Ltd remains a leading supplier of high-purity solder alloys. We offer expert technical guidance for the global electronics industry in 2026.

The post DKL EF-28 Alcohol-Resin Paste Flux appeared first on DKL Metals Ltd.

SN100CV P608 D4 Paste

admin — Fri, 07 Nov 2025 11:03:04 +0000

Superior Silver-Free SAC305 Replacement

DKL Metals, in collaboration with Nihon Superior, proudly presents the SN100CV P608 D4 solder paste, an advanced lead-free solder paste engineered as a direct drop-in replacement for the conventional SAC305 solder alloy. This silver-free solder paste offers excellent performance without the high cost of silver-bearing pastes.

Technical Specifications of SN100CV P608 D4 Solder Paste

Specification	Details
Product Number	SN100CV P608 D4
Variation	D4 (Type 4)
Application	General-purpose (D4)
Type and Features	Silver-free, Completely halogen-free, High strength, Low voiding
Alloy Composition	Sn-0.7Cu-0.05Ni-Ge-Bi
Melting Point	221-225℃
Flux	P608
Flux Category	ROL0
Presence of Halogen Elements	Completely halogen-free
Particle Size	D4 (Type 4): 20-38µm

Features and Benefits of SN100CV P608 D4 Solder Paste

Key Features

Direct drop-in replacement for SAC305 alloy pastes
100% silver-free alloy formulation for cost efficiency
Based on proven SN100CV alloy technology
Long 6-month shelf life for reliable inventory management

Outstanding Benefits

Compatible with existing reflow profiles and printing parameters without adjustments
Significant cost savings and improved joint reliability over SAC305
Superior long-term mechanical strength and resistance to thermal fatigue for enhanced product lifespan
Lower voiding reduces defects and boosts process efficiency

A Smarter, More Reliable Alternative for Lead-Free Soldering

The SN100CV P608 D4 solder paste offers more than just cost savings; it delivers higher reliability in challenging soldering conditions. Its advanced microstructure improves thermal cycling resistance and mechanical stress tolerance, ensuring stronger, more stable connections.

Reduces voiding compared to conventional products.

This completely halogen-free solder paste minimizes void formation, a critical factor in mounting quality. It provides wetting performance equal to or better than halogen-containing counterparts and boasts a high-strength, silver-free alloy composition.

Left: Conventional product after reflow (X-ray photo)

Right: SN100CV P608 D4 after reflow (X-ray photo)

Take the next step today and start reaping the benefits of this brand new superior and cheaper direct replacement to SAC305!

Learn more!

*Check It Out Directly From Nihon Superior*
DKL Metals – Paste Guide

The post SN100CV P608 D4 Paste appeared first on DKL Metals Ltd.

DKL DK-P8 No-Clean Tin/Lead Solder Paste

admin — Sun, 16 Feb 2025 10:08:21 +0000

DKP8 Solder Paste

Description

DKP8 is a halogen-free, no-clean solder paste engineered to deliver exceptional soldering performance with leaded alloys. Designed for a variety of substrate materials including Sn/Pb, Au/Ni, and OSP-treated finishes, DKP8 combines excellent print consistency with strong process flexibility. Its pin-testable formulation allows easy test probe penetration through post-soldering residues, and it is fully compatible with both air and nitrogen reflow systems.

Key Benefits of using DKP8 no clean solder paste

Fast printing speeds: 20–300 mm/sec
No-clean formulation: ROL0 (J-STD-004)
Slump-free – eliminates solder balling and mid-chip balling
Halogen-free – environmentally friendly composition
Consistent, printer-friendly performance
Excellent solderability with up to 72-hour tack life
Suitable for both air and nitrogen reflow

Slump-Free Performance

DKP8’s synthetic gel system ensures higher temperature stability – remaining structurally sound up to 60°C above conventional gel pastes. This design eliminates solder balling and mid-chip defects by preventing premature de-structuring during reflow. The result is cleaner joints, improved cosmetic finish, and enhanced reliability across assemblies.

Profile Friendly

The advanced activator system in DKP8 allows optimal soldering performance across a range of thermal profiles. Whether for low-temperature activation or sustained activity under longer reflow conditions, DKP8 provides engineering flexibility—enabling process optimisation for best yield and minimal defects.

VOC-Free Printing

Utilising a modern solvent package, DKP8 qualifies as VOC-free according to the European Solvent Directive (vapor pressure < 0.1 mbar). This allows environmentally responsible, low-emission printing operations without compromising soldering quality.

Cleaning

Although no cleaning is required, DKP8 residues can be easily removed using DKL’s range of cleaning agents. Our cleaners effectively eliminate flux residues without leaving white stains or crystalline deposits. Recommended cleaning conditions are 25–60°C for 2–5 minutes.

Storage and Shelf Life of DKP8 no clean solder paste

Storage: Room temperature or refrigerated between 0°C and 10°C for best results
Shelf life (refrigerated <10°C):
- 12 months for unopened cartridges and tubs
- 6 months for unopened syringes
Always allow the paste to reach room temperature before opening

Printing Guidelines

Ensure the paste is at room temperature before use. For tubs, stir thoroughly and apply a consistent roll across the stencil. DKP8 provides smooth, reliable printing at speeds between 20–300 mm/sec.

Alloy Availability

Alloy	Composition	Metal Content	Particle Size	Available Packaging
62S	Sn62Pb36Ag2	90.0%	25–45 μm (T3)	1000 g / 500 g cartridges, 500 g / 250 g tubs
63/37	Sn63Pb37	90.0%	25–45 μm (T3)	1000 g / 500 g cartridges, 500 g / 250 g tubs

Other alloys, metal ratios, and packaging options are available upon request.

Manufactured in the UK

DKP8 solder paste is produced in the United Kingdom to the highest standards of consistency and reliability.

*Check Out Our DKP6 Paste*

The post DKL DK-P8 No-Clean Tin/Lead Solder Paste appeared first on DKL Metals Ltd.

Cobar OT2 Lead-Free Solder Paste

admin — Fri, 15 Sep 2023 11:08:54 +0000

/* 1. MAIN WRAPPERS */ .product-custom-layout { padding: 10px 0; background: #fff; contain: layout; font-family: Arial, sans-serif; line-height: 1.6; color: #333; } .product-custom-layout__container { max-width: 800px; width: 100%; margin: 0 auto; box-sizing: border-box;} /* 2. THE BIG BLUE H1 & HEADINGS */ .product-custom-layout + h1, .product-page h1, .entry-title, .page-title { background: linear-gradient(135deg, #1e3a8a, #3b82f6) !important; color: white !important; text-align: center !important; padding: 10px !important; border-radius: 10px !important; font-size: 2.5em !important; margin: 0 0 20px 0 !important; text-shadow: 2px 2px 4px rgba(0,0,0,0.3) !important; display: block !important; } .product-custom-layout h2 { color: #1e3a8a; border-bottom: 3px solid #3b82f6; padding-bottom: 10px; font-size: 2.2em; margin: 30px 0 15px 0; } .product-custom-layout h3 { color: #1e40af; font-size: 1.4em; margin: 30px 0 15px 0; display: flex; align-items: center; gap: 10px; } /* 3. TABLES */ .flux-specs-table { width: 100%; border-collapse: collapse; margin: 25px 0; box-shadow: 0 10px 30px rgba(0,0,0,0.1); border-radius: 10px; overflow: hidden; } .flux-specs-table th { background: linear-gradient(135deg, #1e3a8a, #3b82f6); color: white; padding: 15px; text-align: left; } .flux-specs-table td { padding: 15px; border-bottom: 1px solid #eee; white-space: nowrap;} .flux-specs-table tr:nth-child(even) { background: #f8fafc; } /* 4. UNIFIED DROPDOWNS (Alloys & FAQ) */ .alloy-dropdown-section details, .solder-faq-section details { background: #f8fafc; border: 1px solid #e2e8f0; border-radius: 8px; margin-bottom: 10px; transition: all 0.3s ease; } details[open] { background: #fff !important; border-color: #3b82f6 !important; box-shadow: 0 4px 12px rgba(59, 130, 246, 0.1); } summary { list-style: none; display: flex; align-items: center; padding: 15px 20px; cursor: pointer; font-weight: bold; color: #1e3a8a; } summary span { margin-left: auto; transition: transform 0.3s ease; font-size: 1.2em; } details[open] summary span { transform: rotate(45deg); color: #3b82f6; } .dropdown-content { padding: 0 20px 20px 20px; color: #4b5563; } /* 5. THE BLUEPRINT CARDS */ .flux-cards { display: flex; gap: 15px; margin-top: 25px; flex-wrap: wrap;} .flux-card { flex: 1 1 250px; background: #fff; border: 1px solid #e2e8f0; border-radius: 16px; padding: 30px 25px; position: relative; overflow: hidden; transition: all 0.4s cubic-bezier(0.175, 0.885, 0.32, 1.275); } .flux-card::before { content: "OT2"; position: absolute; bottom: -10px; right: -5px; font-size: 5em; font-weight: 900; color: #f8fafc; z-index: 0; pointer-events: none; } .flux-card::after { content: ""; position: absolute; left: 0; top: 0; height: 100%; width: 5px; background: #3b82f6; opacity: 0.5; } .flux-card:hover { transform: translateY(-8px); box-shadow: 0 20px 25px -5px rgba(59, 130, 246, 0.1); border-color: #3b82f6; } .flux-card h4 { color: #1e3a8a; font-size: 1.4em; margin: 0 0 10px 0; position: relative; z-index: 1; font-weight: 800; } .flux-card p { font-size: 0.95em; margin: 0; position: relative; z-index: 1; } .microns { display: inline-block; background: #eff6ff; color: #1e40af; padding: 2px 8px; border-radius: 4px; font-weight: bold; margin-bottom: 10px; position: relative; z-index: 1; } @media (max-width: 1024px) { .product-custom-layout { margin-left: 0 !important; margin-right: 0 !important; width: auto !important; } .product-custom-layout__container { padding: 0 10px !important; max-width: 100% !important; } } @media (max-width: 768px) { .product-custom-layout h2 { font-size: 1.8em !important; } .flux-specs-table td, .flux-specs-table th { padding: 10px 8px !important; font-size: 0.9em; } summary { padding: 12px 15px !important; font-size: 0.95em; } }

Official Partner and UK Distributor

DKL Metals Ltd is the official UK distribution partner for Balver Zinn and Cobar electronics assembly materials. The Cobar OT2 no-clean solder paste platform represents the next generation of high-reliability SMT assembly line optimization. Formulated with a completely halogen and halide-free flux chemistry, this paste series is engineered to deliver defect-free printing and exceptional wetting across complex PCB topologies.

Core Technical Specifications

This versatile flux system provides a wide process window for modern surface mount technology, meeting strict environmental compliance and high-speed production line demands.

Process Parameter	Specification Details
Flux Classification	ROL0 (Halogen & Halide Free No-Clean)
Maximum Print Speed	Up to 200 – 250 mm/s
Recommended Squeegee Pressure	0.20 – 0.25 kg/cm (at 23 °C ambient)
Optimal Operating Environment	22-28 °C and 30-70% Relative Humidity
Open Stencil / Tack Time	Up to 24 Hours post-printing

Powder Size Availability: We stock and supply the OT2 flux chemistry across multiple standardised particle distributions to match fine-pitch components and precise stencil apertures.

25 – 45 Microns

Type 3 Powder (T3)

The standard industry choice for reliable, general-purpose electronics manufacturing and classic SMT component spacing.

20 – 38 Microns

Type 4 Powder (T4)

Engineered for fine-pitch printing applications, small passive components, and high-density PCB geometries.

Available Alloy Configurations

Select your alloy compound based on your specific joint strength, processing temperature, and manufacturing cost targets.

DKL Clearflow DK-P6 Solder Paste

admin — Fri, 15 Sep 2023 11:08:54 +0000

/* 1. MAIN WRAPPERS */ .product-custom-layout { padding: 10px 0; background: #fff; contain: layout; font-family: Arial, sans-serif; line-height: 1.6; color: #333; } .product-custom-layout__container { max-width: 800px; width: 100%; margin: 0 auto; box-sizing: border-box;} /* 2. THE BIG BLUE H1 & HEADINGS */ .product-custom-layout + h1, .product-page h1, .entry-title, .page-title { background: linear-gradient(135deg, #1e3a8a, #3b82f6) !important; color: white !important; text-align: center !important; padding: 10px !important; border-radius: 10px !important; font-size: 2.5em !important; margin: 0 0 20px 0 !important; text-shadow: 2px 2px 4px rgba(0,0,0,0.3) !important; display: block !important; } .product-custom-layout h2 { color: #1e3a8a; border-bottom: 3px solid #3b82f6; padding-bottom: 10px; font-size: 2.2em; margin: 30px 0 15px 0; } .product-custom-layout h3 { color: #1e40af; font-size: 1.4em; margin: 30px 0 15px 0; display: flex; align-items: center; gap: 10px; } /* 3. TABLES */ .flux-table-wrapper { width: 100%; overflow-x: auto; -webkit-overflow-scrolling: touch; margin: 25px 0; border-radius: 10px; box-shadow: 0 10px 30px rgba(0,0,0,0.1); } .flux-specs-table { width: 100%; border-collapse: collapse; margin: 0; overflow: hidden; } .flux-specs-table th { background: linear-gradient(135deg, #1e3a8a, #3b82f6); color: white; padding: 15px; text-align: left; } .flux-specs-table td { padding: 15px; border-bottom: 1px solid #eee; white-space: nowrap;} .flux-specs-table tr:nth-child(even) { background: #f8fafc; } /* 4. UNIFIED DROPDOWNS (Alloys & FAQ) */ .alloy-dropdown-section details, .solder-faq-section details { background: #f8fafc; border: 1px solid #e2e8f0; border-radius: 8px; margin-bottom: 10px; transition: all 0.3s ease; } details[open] { background: #fff !important; border-color: #3b82f6 !important; box-shadow: 0 4px 12px rgba(59, 130, 246, 0.1); } summary { list-style: none; display: flex; align-items: center; padding: 15px 20px; cursor: pointer; font-weight: bold; color: #1e3a8a; } summary span { margin-left: auto; transition: transform 0.3s ease; font-size: 1.2em; } details[open] summary span { transform: rotate(45deg); color: #3b82f6; } .dropdown-content { padding: 0 20px 20px 20px; color: #4b5563; } /* 5. THE BLUEPRINT CARDS */ .flux-cards { display: flex; gap: 15px; margin-top: 25px; flex-wrap: wrap;} .flux-card { flex: 1 1 250px; background: #fff; border: 1px solid #e2e8f0; border-radius: 16px; padding: 30px 25px; position: relative; overflow: hidden; transition: all 0.4s cubic-bezier(0.175, 0.885, 0.32, 1.275); } .flux-card::before { content: "DKP6"; position: absolute; bottom: -10px; right: -5px; font-size: 5em; font-weight: 900; color: #f8fafc; z-index: 0; pointer-events: none; } .flux-card::after { content: ""; position: absolute; left: 0; top: 0; height: 100%; width: 5px; background: #3b82f6; opacity: 0.5; } .flux-card:hover { transform: translateY(-8px); box-shadow: 0 20px 25px -5px rgba(59, 130, 246, 0.1); border-color: #3b82f6; } .flux-card h4 { color: #1e3a8a; font-size: 1.4em; margin: 0 0 10px 0; position: relative; z-index: 1; font-weight: 800; } .flux-card p { font-size: 0.95em; margin: 0; position: relative; z-index: 1; } .microns { display: inline-block; background: #eff6ff; color: #1e40af; padding: 2px 8px; border-radius: 4px; font-weight: bold; margin-bottom: 10px; position: relative; z-index: 1; } @media (max-width: 1024px) { .product-custom-layout { margin-left: 0 !important; margin-right: 0 !important; width: auto !important; } .product-custom-layout__container { padding: 0 10px !important; max-width: 100% !important; } } @media (max-width: 768px) { .product-custom-layout h2 { font-size: 1.8em !important; } .flux-specs-table td, .flux-specs-table th { padding: 10px 8px !important; font-size: 0.9em; } summary { padding: 12px 15px !important; font-size: 0.95em; } }

DKL Clearflow DK-P6 delivers a no-clean, halogen and halide free, lead-free solder paste for high reliability SMT assembly. It combines excellent print definition, long stencil life and clear, probe-testable residues. Electronics manufacturers trust it in demanding environments. Order now for superior performance.

Type 3

Standard Pitch

Optimised powder sizing for general SMT manufacturing runs and component placement.

Type 4

Fine Pitch

Excellent paste release characteristics for high-density, small-footprint pad geometries.

Type 5

Ultra-Fine Pitch

Maximum definition and paste transfer integrity for advanced micro-SMT processing.

SAC305 Reflow Profile Parameters

DKL Clearflow DK-P6 optimises for SAC305 reflow profiles. Testing to J-STD-005A and J-STD-004B shows no slump to 0.2 mm. It eliminates solder balling and delivers high surface insulation resistance above 100 MΩ. It passes copper corrosion tests for long-term reliability in harsh conditions.

Reflow Stage	Target Specification Parameters
Ramp Rate	1–3°C per second ramp up to 190°C
Soak Zone	190–200°C temperature zone maintained for 60–120 seconds
Peak Temperature	238–250°C peak target profile window
Time Above Liquidus	45–75 seconds duration spent above melting threshold
Total Cycle Time	4–5 minutes recommended gross heating curve window

Solder Paste Properties & Print Definition

DKL Clearflow DK-P6 no-clean lead-free solder paste uses a high-purity SAC305 alloy with 88.5% metal loading to guarantee stable printing performance across all modern, high-density SMT manufacturing lines.

Standard Packing Options & Formats

Cartridges: 1000g | 500g
Jars & Tubs: 1000g | 500g | 250g
Syringes: Custom capacities available upon request

Alternative alloys, metal loading percentages, and bespoke packaging configurations are easily manufactured to suit your specific automated SMT printer lines.

Frequently Asked Questions

Which PCB surface finishes are compatible with no-clean lead-free solder paste? +