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Superior Silver-Free SAC305 Replacement

DKL Metals, in collaboration with Nihon Superior, proudly presents the SN100CV P608 D4 solder paste, an advanced lead-free solder paste engineered as a direct drop-in replacement for the conventional SAC305 solder alloy. This silver-free solder paste offers excellent performance without the high cost of silver-bearing pastes.

Technical Specifications of SN100CV P608 D4 Solder Paste

Features and Benefits of SN100CV P608 D4 Solder Paste

A Smarter, More Reliable Alternative for Lead-Free Soldering

The SN100CV P608 D4 solder paste offers more than just cost savings; it delivers higher reliability in challenging soldering conditions. Its advanced microstructure improves thermal cycling resistance and mechanical stress tolerance, ensuring stronger, more stable connections.

Reduces voiding compared to conventional products.

This completely halogen-free solder paste minimizes void formation, a critical factor in mounting quality. It provides wetting performance equal to or better than halogen-containing counterparts and boasts a high-strength, silver-free alloy composition.

Left: Conventional product after reflow (X-ray photo)

Right: SN100CV P608 D4 after reflow (X-ray photo)

Take the next step today and start reaping the benefits of this brand new superior and cheaper direct replacement to SAC305!

Learn more!

*Check It Out Directly From Nihon Superior*
DKL Metals – Paste Guide

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Description

DKP8 is a halogen-free, no-clean solder paste engineered to deliver exceptional soldering performance with leaded alloys. Designed for a variety of substrate materials including Sn/Pb, Au/Ni, and OSP-treated finishes, DKP8 combines excellent print consistency with strong process flexibility. Its pin-testable formulation allows easy test probe penetration through post-soldering residues, and it is fully compatible with both air and nitrogen reflow systems.

Key Benefits of using DKP8 no clean solder paste

• Fast printing speeds: 20–300 mm/sec
• No-clean formulation: ROL0 (J-STD-004)
• Slump-free – eliminates solder balling and mid-chip balling
• Halogen-free – environmentally friendly composition
• Consistent, printer-friendly performance
• Excellent solderability with up to 72-hour tack life
• Suitable for both air and nitrogen reflow

Slump-Free Performance

DKP8’s synthetic gel system ensures higher temperature stability – remaining structurally sound up to 60°C above conventional gel pastes. This design eliminates solder balling and mid-chip defects by preventing premature de-structuring during reflow. The result is cleaner joints, improved cosmetic finish, and enhanced reliability across assemblies.

Profile Friendly

The advanced activator system in DKP8 allows optimal soldering performance across a range of thermal profiles. Whether for low-temperature activation or sustained activity under longer reflow conditions, DKP8 provides engineering flexibility—enabling process optimisation for best yield and minimal defects.

VOC-Free Printing

Utilising a modern solvent package, DKP8 qualifies as VOC-free according to the European Solvent Directive (vapor pressure < 0.1 mbar). This allows environmentally responsible, low-emission printing operations without compromising soldering quality.

Cleaning

Although no cleaning is required, DKP8 residues can be easily removed using DKL’s range of cleaning agents. Our cleaners effectively eliminate flux residues without leaving white stains or crystalline deposits. Recommended cleaning conditions are 25–60°C for 2–5 minutes.

Storage and Shelf Life of DKP8 no clean solder paste

• Storage: Room temperature or refrigerated between 0°C and 10°C for best results
• Shelf life (refrigerated <10°C):
  • 12 months for unopened cartridges and tubs
  • 6 months for unopened syringes
• Always allow the paste to reach room temperature before opening

Printing Guidelines

Ensure the paste is at room temperature before use. For tubs, stir thoroughly and apply a consistent roll across the stencil. DKP8 provides smooth, reliable printing at speeds between 20–300 mm/sec.

Alloy Availability

Other alloys, metal ratios, and packaging options are available upon request.

Manufactured in the UK

DKP8 solder paste is produced in the United Kingdom to the highest standards of consistency and reliability.

*Check Out Our DKP6 Paste*

The post DKL DK-P8 No-Clean Tin/Lead Solder Paste appeared first on DKL Metals Ltd.

• DKL Paste PF-32G FMQ is a Lead-free, no clean, ready to use solder paste for air or Nitrogen reflow applications.
• DKL Paste PF-25 FMQ is a ready to use, Lead-free, no-clean solder paste based on the SN100C alloy system, for use in air or nitrogen reflow applications. Print speeds achieved up to 150mm/s with excellent print characteristics down to 16-20 mils pitch.
• DKL Paste PF-26 FMQ is also ready to use, Lead-free, no-clean solder paste based on the SN100C alloy. Print speeds achieved up to 100mm/s with excellent print characteristics down to 16-20 mils pitch.

Please contact us if you have a specific paste requirement.

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DKL Clearflow DK-P6 No-Clean Lead-Free Solder Paste for SMT

DKL Clearflow DK-P6 no-clean lead-free solder paste uses a SAC305 alloy with 88.5% metal content. It suits RoHS-compliant surface mount assemblies perfectly. You achieve consistent wetting and reliable joint formation. This paste delivers defect-free soldering on OSP, ENIG, silver, tin and HASL finishes. It supports high quality results across diverse board technologies.

True Halogen and Halide Free Flux Chemistry (ROL0)

DK-P6 employs a flux system classified as ROL0 to J-STD-004B. It provides very low activity with minimal, clear residues. These residues stay safe on assemblies during no-clean processing. Ion chromatography verifies the flux as halogen and halide free. It shows no added halide-bearing materials. Manufacturers meet stringent reliability and environmental requirements easily. Learn more about DKL Metals’ commitment to quality and environmental standards.

Print Performance and Stencil Life for Fine Pitch SMT

This lead-free solder paste comes in Type 3, Type 4 and Type 5 powder size options. It offers excellent print definition for fine pitch and ultra-fine pitch components. You use it in high density SMT designs. DK-P6 provides extended open times over three days. It ensures long stencil life and 72-hour tack life. You reduce downtime, boost first-pass yield and maintain stable high-volume production.

Reflow Profile and Reliability Testing

DKL Clearflow DK-P6 optimises for SAC305 reflow profiles. It uses a 1–3°C per second ramp to 190°C. You soak at 190–200°C for 60–120 seconds. It peaks at 238–250°C with 45–75 seconds above liquidus. The total profile lasts 4–5 minutes. Testing to J-STD-005A and J-STD-004B shows no slump to 0.2 mm. It eliminates solder balling and delivers high surface insulation resistance above 100 MΩ. It passes copper corrosion tests for long-term reliability in harsh conditions.

Packaging, Storage and Handling of DK-P6 solder paste

DK-P6 solder paste comes from UK manufacturing. It arrives in 1000 g and 500 g cartridges plus 1000 g, 500 g and 250 g tubs. You request alternative alloys, metal percentages and units easily. Store DK-P6 at room temperature. Refrigerate below 10°C for 12 months shelf life on unopened cartridges and tubs. It lasts 6 months for unopened syringes. Bring paste to room temperature and stir before printing for optimum performance.

Enquire now for lead-free electronic solder paste!

Learn More: Wikipedia – Solder Paste

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