DKL Clearflow DK-P6 Solder Paste
DKL Clearflow DK-P6 delivers a no-clean, halogen and halide free, lead-free solder paste for high reliability SMT assembly. It combines excellent print definition, long stencil life and clear, probe-testable residues. Electronics manufacturers trust it in demanding environments. Order now for superior performance.
Standard Pitch
Optimised powder sizing for general SMT manufacturing runs and component placement.
Fine Pitch
Excellent paste release characteristics for high-density, small-footprint pad geometries.
Ultra-Fine Pitch
Maximum definition and paste transfer integrity for advanced micro-SMT processing.
SAC305 Reflow Profile Parameters
DKL Clearflow DK-P6 optimises for SAC305 reflow profiles. Testing to J-STD-005A and J-STD-004B shows no slump to 0.2 mm. It eliminates solder balling and delivers high surface insulation resistance above 100 MΩ. It passes copper corrosion tests for long-term reliability in harsh conditions.
| Reflow Stage | Target Specification Parameters |
|---|---|
| Ramp Rate | 1–3°C per second ramp up to 190°C |
| Soak Zone | 190–200°C temperature zone maintained for 60–120 seconds |
| Peak Temperature | 238–250°C peak target profile window |
| Time Above Liquidus | 45–75 seconds duration spent above melting threshold |
| Total Cycle Time | 4–5 minutes recommended gross heating curve window |
Solder Paste Properties & Print Definition
DKL Clearflow DK-P6 no-clean lead-free solder paste uses a high-purity SAC305 alloy with 88.5% metal loading to guarantee stable printing performance across all modern, high-density SMT manufacturing lines.
Standard Packing Options & Formats
- Cartridges: 1000g | 500g
- Jars & Tubs: 1000g | 500g | 250g
- Syringes: Custom capacities available upon request
Alternative alloys, metal loading percentages, and bespoke packaging configurations are easily manufactured to suit your specific automated SMT printer lines.
Frequently Asked Questions
Which PCB surface finishes are compatible with no-clean lead-free solder paste? +
Compatible PCB surface finishes include OSP, ENIG, immersion silver, immersion tin, and HASL. This paste delivers stable wetting profiles and defect-free soldering across all of these standard metallic and organic board coatings.
What is the typical stencil life and tack time for fine pitch SMT solder paste? +
The typical stencil life is over 3 days (72 hours), maintaining a reliable 72-hour tack life window. This extended open time provides excellent print definition for fine pitch and ultra-fine pitch components while significantly reducing assembly line downtime.
What does an ROL0 flux classification mean for electronic circuit reliability? +
An ROL0 classification means the flux contains zero detectable halides and poses the lowest possible risk for corrosion or electrical failure. Under J-STD-004B specifications, this ensures minimal, transparent, and completely probe-testable residues that are 100% safe to leave on assemblies without washing.
How is a solder paste verified as completely halogen and halide-free? +
Solder paste is verified as halogen-free through rigorous ion chromatography testing to ensure no halide materials were added. This independent material verification allows modern electronic assemblies to pass strict international environmental compliance checks effortlessly.
What are the recommended storage temperatures and shelf life for SAC305 solder paste? +
The recommended storage temperature is refrigerated below 10°C, providing a 12-month shelf life for tubs and cartridges. For unopened syringe units, the shelf life is 6 months. Always allow the paste to naturally warm to room temperature and stir thoroughly before beginning a production print run.