DKL DK-P8 No-Clean Tin/Lead Solder Paste
DKP8 Solder Paste
Description
DKP8 is a halogen-free, no-clean solder paste engineered to deliver exceptional soldering performance with leaded alloys. Designed for a variety of substrate materials including Sn/Pb, Au/Ni, and OSP-treated finishes, DKP8 combines excellent print consistency with strong process flexibility. Its pin-testable formulation allows easy test probe penetration through post-soldering residues, and it is fully compatible with both air and nitrogen reflow systems.
Key Benefits of using DKP8 no clean solder paste
- Fast printing speeds: 20–300 mm/sec
- No-clean formulation: ROL0 (J-STD-004)
- Slump-free – eliminates solder balling and mid-chip balling
- Halogen-free – environmentally friendly composition
- Consistent, printer-friendly performance
- Excellent solderability with up to 72-hour tack life
- Suitable for both air and nitrogen reflow
Slump-Free Performance
DKP8’s synthetic gel system ensures higher temperature stability – remaining structurally sound up to 60°C above conventional gel pastes. This design eliminates solder balling and mid-chip defects by preventing premature de-structuring during reflow. The result is cleaner joints, improved cosmetic finish, and enhanced reliability across assemblies.
Profile Friendly
The advanced activator system in DKP8 allows optimal soldering performance across a range of thermal profiles. Whether for low-temperature activation or sustained activity under longer reflow conditions, DKP8 provides engineering flexibility—enabling process optimisation for best yield and minimal defects.
VOC-Free Printing
Utilising a modern solvent package, DKP8 qualifies as VOC-free according to the European Solvent Directive (vapor pressure < 0.1 mbar). This allows environmentally responsible, low-emission printing operations without compromising soldering quality.
Cleaning
Although no cleaning is required, DKP8 residues can be easily removed using DKL’s range of cleaning agents. Our cleaners effectively eliminate flux residues without leaving white stains or crystalline deposits. Recommended cleaning conditions are 25–60°C for 2–5 minutes.
Storage and Shelf Life of DKP8 no clean solder paste
- Storage: Room temperature or refrigerated between 0°C and 10°C for best results
- Shelf life (refrigerated <10°C):
- 12 months for unopened cartridges and tubs
- 6 months for unopened syringes
- Always allow the paste to reach room temperature before opening
Printing Guidelines
Ensure the paste is at room temperature before use. For tubs, stir thoroughly and apply a consistent roll across the stencil. DKP8 provides smooth, reliable printing at speeds between 20–300 mm/sec.
Alloy Availability
| Alloy | Composition | Metal Content | Particle Size | Available Packaging |
|---|---|---|---|---|
| 62S | Sn62Pb36Ag2 | 90.0% | 25–45 μm (T3) | 1000 g / 500 g cartridges, 500 g / 250 g tubs |
| 63/37 | Sn63Pb37 | 90.0% | 25–45 μm (T3) | 1000 g / 500 g cartridges, 500 g / 250 g tubs |
Other alloys, metal ratios, and packaging options are available upon request.
Manufactured in the UK
DKP8 solder paste is produced in the United Kingdom to the highest standards of consistency and reliability.