JEAN-151 No-Clean Solder Paste
A Solder Paste Designed for Reflow and Vapor Phase Soldering
As an official UK distributor, DKL Metals provides Balver Zinn JEAN-151 No-Clean Solder Paste. This versatile flux platform meets the high demands of modern SMT assembly. The halide-free, ROL0 flux actively prevents bridging and mid-chip solder balling. It remains highly effective even for challenging fine-pitch applications. The platform supports many alloys, from high-reliability SN100CV® to standard SAC305. It performs just as well in vapour phase soldering as it does in reflow. An exceptional 24-hour stencil life keeps your line running longer with less waste. Finally, clear, probe-testable residues ensure your quality control remains seamless.
Technical Specifications
| Standard / Property | Classification / Value |
|---|---|
| DIN-EN-29454-1: 2016 | 1122 |
| IPC-J-STD-004-B: 2004 | ROL0 |
| IPC-J-STD-005 (Powder) | T3 / T4 / T5 |
| Particle Size [µm] | 25-45 / 20-38 / 15-25 |
Available Alloy Configurations
SN100C® +
This is a silver-free, nickel-stabilised eutectic tin-copper alloy (Sn99.3Cu0.7NiGe) that’s the lowest-cost Pb-free option compatible with JEAN-151. It delivers shiny joints, excellent thermal/electrical conductivity, and minimal copper dissolution for reliable industrial and consumer electronics assembly in reflow or vapor phase. View the SN100C T3(T4) application note now!
| Property | Value |
|---|---|
| Alloy Composition | Sn99.3Cu0.7NiGe |
| Solidus/Liquidus | 227°C |
| Peak Temp | 238-260°C |
| Key Benefits | Cost-effective; shiny joints; low dross |
Type 3
The industry workhorse. Best for standard SMT components and consistent aperture release.
Type 4
Fine-pitch specialist. Engineered for high-density boards where bridging is a risk.
SN100CV® +
This is a high-reliability alloy based on the SN100C platform with added Bismuth for increased strength. It matches the performance of SAC alloys without the cost or reliability issues of silver. View the SN100CV application note now!
| Property | Value |
|---|---|
| Composition | SnCuNiGeBi |
| Solidus/Liquidus | 221-225°C |
| Peak Temp | 238-260°C |
| Key Benefit | Thermal cycling stability |
Type 4
Enhanced strength for dense, fine-pitch assemblies.
SAC305 +
SAC305 is the world’s most widely used lead-free alloy. Combined with JEAN-151 No-Clean Solder Paste, it provides industry-standard wetting and fatigue resistance for all SMT processes. View the SAC305 T3(T4-T5) application note now!
| Property | Value |
|---|---|
| Composition | Sn96.5Ag3.0Cu0.5 |
| Solidus/Liquidus | 217-219°C |
| Key Benefit | Universal compatibility |
Type 3
Standard for high-rel industrial & automotive applications.
Type 4
Precision printing for standard silver-bearing processes.
Type 5
Ultra-fine pitch capable for miniature component assembly.
Frequently Asked Questions
What is the recommended storage temperature for JEAN-151 solder paste? +
For optimum performance and to achieve its minimum 12 month shelf life, JEAN-151 should be stored refrigerated between 4°C and 10°C. Ensure the paste reaches room temperature (approx. 6–8 hours) before opening the jar to prevent moisture condensation.
What is the stencil life of JEAN-151? +
This flux platform offers an exceptional 24-hour stencil life. It maintains consistent viscosity and rolling behaviour even in high-humidity environments, reducing waste during long production runs.
How should I clean the stencil and PCB? +
JEAN-151 is a No-Clean solder paste; residues are clear, non-corrosive, and probe-testable. If cleaning is required for aesthetic or conformal coating reasons, standard SMT stencil cleaners or IPA-based solutions work effectively.
What is the shelf life of JEAN-151 when supplied by DKL Metals? +
When stored correctly under refrigeration (4-10°C), JEAN-151 has a guaranteed shelf life of 12 months from the date of manufacture. DKL Metals ensures all batches are labelled with specific expiry dates for full traceability.