After receiving your solder paste from DKL Metals, it should immediately be stored between 8 °C and ambient room temperature. Unlike traditional pastes, DO NOT store Cobar OT2 in a standard refrigerator or below 8 °C, as low temperatures can compromise the stability of this specific chemistry. Always store cartridges horizontally and rotate them monthly to eliminate flux segregation.

No. Cobar OT2 is a true no-clean formula. The clear residues remaining on the printed board assembly (PBA) after soldering are completely chemically inert, non-conductive, and safe to leave on the board. However, if cosmetic cleaning or subsequent conformal coating is required, residues can be removed using Cobar MCA-1424 aqueous cleaner. Misprints and stencil tools can be cleaned with MCI-2330.

The Cobar OT2 platform features an advanced activator system specifically engineered to eliminate graping and head-in-pillow (HiP) defects during reflow. To maximize its effectiveness on poor-wetting board finishes, utilise a linear reflow profile. Ensure your flux activation time (FAT) between 150 °C and 200 °C remains between 20 to 150 seconds, with a peak reflow temperature between 240 °C and 260 °C.

Printing speeds between 25–100 mm/s, apply a squeegee pressure of 0.20 kg/cm. For high-speed SMT printing between 100–200 mm/s, increase pressure slightly to 0.25 kg/cm. It is recommended to decrease pressure by 5% for every 1 °C rise in ambient temperature above 23 °C. If your printing line halts for more than 4 hours, a total stencil clean is highly recommended before restarting.